The latest 3U VPX embedded system from
Extreme Engineering Solutions (X-ES)
sets a new standard for high-bandwidth data acquisition and signal
processing in harsh environments.
With multiple high-speed optical
links, an Intel® Xeon® D-1500 processor, and a Xilinx Kintex®
UltraScale™ FPGA, the XPand6215 offers uncompromising performance and
reliability in a SWaP-optimised two-slot system.
High-Speed, Fibre Optic Communications
The
XPand6215 is a commercial-off-the-shelf (COTS) rugged chassis hosting two conduction-cooled 3U VPX modules. One slot contains the
XPedite2570, a reconfigurable fibre-optic I/O module based on the Xilinx Kintex® UltraScale™ family of FPGAs.
The XPedite2570 supplies 12 protocol-independent optical transceivers
operating at up to 10.3125 Gb/s, along with 8 GB of DDR4 ECC SDRAM in
two channels capable of up to 38 GB/s aggregate bandwidth. The
transceivers utilise 50/125 μm multi-mode fibre with MT connectors and
are qualified over the full -40°C to +85°C industrial temperature range
for reliable performance in extreme environments.
These optical links are paired with a user-programmable Xilinx Kintex®
UltraScale™ FPGA, which provides a blend of performance and
cost-effectiveness that is ideal for packet processing and DSP-intensive
processing in embedded applications.
Unparalleled, Multi-Core Processing Power
The other slot of the XPand6215 contains the
XPedite7670,
a 3U VPX Single Board Computer based on the Intel® Xeon® D-1500 family
of processors (formerly Broadwell-DE). Available with up to 16
Xeon®-class cores in a single, power-efficient System-on-Chip (SoC)
package, this processor puts the XPand6215 in the upper echelon of
embedded system performance. Xeon® D processors with up to 12 cores
offer native extended temperature support with an operating temperature
range of -40⁰C to +85⁰C.
The XPedite7670 also provides up to 16 GB of DDR4-2133 ECC SDRAM, while an
XPort3305 10 Gigabit Ethernet XMC module installed on the XPedite7670 provides a rugged 10GBASE-SR Ethernet port.
Industry-Leading Functional Density in a Small Form Factor (SFF) Enclosure
The XPand6215 makes the most of every pound and square inch, packing
maximum functionality into a streamlined two-slot design. Its integrated
28 VDC power supply eliminates the need for an additional power supply
slot. It also includes a memory bay for a removable 2.5 in. solid-state
drive (SSD), adding the option for up to 1 TB of storage. Fully loaded,
the system weighs approximately 4kg, making it ideal for cutting-edge military and
industrial applications that require small, lightweight solutions.
Qualified to the MIL-STD-461E/F, MIL-STD-810, and MIL-STD-704F
standards, the XPand6215 has passed a battery of tests to ensure
reliable operation in even the most challenging environments.
The XPand6200 Series of rugged, embedded systems are available in a
diverse range of configurations, making them uniquely-suited to a
variety of processing-intensive applications.
Please contact Sarsen
Technology to discuss your requirements.