Article - The Bus Too Tough To Die!

 

MilesTek has offered complete connectivity solutions since 1981, and since then their customers have come to expect more than just top quality products. MilesTek provides answers that help customers solve their installation or project questions, as well as writing and sharing useful articles, white papers and industry news. 

The latest article from the Mil/Aero component experts at MilesTek is an in-depth look at the MIL-STD-1553 bus.

Considering how long it's been in service, the MIL-STD-1553B bus has survived remarkably well, despite other, more advanced solutions having gained wide acceptance in the last few years.

However, the fact remains that the maximum data rate of 1Mb/s is orders of magnitude too slow for today’s data-intensive systems, therefore on paper logic dictates that it will soon fade away. That may be a logical assumption, but it’s likely to prove wrong, for several reasons.

 The most obvious is that MIL-STD-1553B continues to fly on at least 30,000 aircraft, as well as on commercial and military ships, and is widely used in industrial and ……

To continue reading this article which was originally published in Aerospace & Defense Technology please click here.

Embedded World 2018 - Highlights from Nuremberg

From 27 February until the end of the day tomorrow the focus is once again on all things embedded.

The embedded technology community has joined together at the Nuremberg Exhibition Centre to shine a spotlight exclusively on the latest trends in the sector, with more than 1,000 exhibitors presenting state-of-the-art covering all aspects of embedded systems.

This year Mike Blee from Sarsen Technology is joining representatives from ECRIN Systems, VersaLogic and DAVE Embedded Systems to showcase all the latest and greatest innovations from these market leading companies.

ECRIN Systems www.ecrin.com	Hall 2 - Stand 449	This is the first time ECRIN Systems has exhibited at Embedded World. The new µONYX SWaP-C rugged system, based on the Intel Core i7 Skylake SoC will be on display, alongside their VPX COTS Boards, Mil-COTS and rugged systems. Embedded World will also be the first time visitors can see the brand new myOPALE modular system. myOPALE provides a simple solution for applications that need more I/O boards than can be fitted in a standard Industrial PC based on backplane PCB.
VersaLogic www.versalogic.com	Hall 3 - Stand 259	VersaLogic Corporation is the trusted name in embedded computer products. Featuring 5 to 10 year availability, -40 to +85° C operating temperature, MIL-STD 202G shock and vibration testing, and outstanding US-based support, VersaLogic products are ideal for critical applications that value ruggedness, reliability and long life. VersaLogic will be officially introducing their newest embedded computer product line at Embedded World. Built around ARM processors for low power, lower performance requirements using the COM Express form factor (95x125 mm), the EPC line offers designed in reliability and is validated to withstand extreme temperatures and high-impact/vibrations. The first board in the EPC family is the rugged Tetra (VL-EPC-2700)
DAVE Embedded Systems www.dave.eu	Hall 4 - Stand 481	DAVE Embedded Systems is a well-established Italian company, focussed on the design of highly complex miniaturised embedded electronic systems. This year DAVE Embedded Systems is celebrating their 20th anniversary, so join them at embedded world 2018 where they will be showcasing their past and present solutions with a new booth design. Their latest technology successes includes the Xilinx Zynq-based BORA SoM and their new range of single board computers.

Embedded World 2018 Photos:

DAVE Embedded - Hall 4 Stand 481

ECRIN Systems - Hall 2 Stand 449

Mike Blee from Sarsen Technology supporting DAVE

New NVIDIA CUDA-based 3U VPX GPGPU Module is a Game Changer!

With the recent release of the Condor GR3 3U VPX from EIZO Rugged Solutions we are excited to be now be in a position able to offer a powerful, complete single-slot 3U VPX GPGPU solution, based on the Condor GR3 and the XPedite7501 XMC module from Extreme Engineering Solutions.

This combination offers an ideal graphics processing solution for a wide range of high performance and compute intensive project requirements. Radar, airborne Intelligence, Surveillance, and Reconnaissance (ISR) applications where size, weight, and power (SWaP) and system flexibility are key considerations. This architecture allows for an easy and versatile upgrade path of both the graphics module and the SBC.

Both boards are rugged, MIL-STD-810 compliant, and support extended temperature operation (-40°C to +85°C) for use in extreme environments, providing performance-oriented GPGPU customers a complete solution that doesn’t compromise on reliability.

The Condor GR3 3U VPX GPGPU solution hosts NVIDIA’s GeForce GTX-950M processor with 640 CUDA cores and 1,271 TFLOPs of floating point performance, and supports multiple I/O interfaces including Ethernet, RS-232, USB, and SATA.

The XPedite7501 is a high-performance, low-power, XMC module based on the 5th generation Intel® Core™ i7 Broadwell-H processor. With up to three PCI Express Gen3-capable ports and two Gigabit Ethernet ports, the XPedite7501 is ideal for high-bandwidth data processing applications. The XPedite7501 also leverages Intel® Iris™ Pro graphics for graphics-intensive applications and serves as a general-purpose GPU for demanding data processing applications.

For more information please contact the Sarsen Technology team on +44 1672 511166 or send us an email with your requirements - info@sarsen.net

Condor GR3 3U VPX Features

XPedite7501 Features

3U VPX form factor (conduction cooled) Designed for SWaP constrained applications NVIDIA® Maxwell™ GPU  GeForce® GTX 950M XMC site for hosting an XMC form factor computer Two configurations currently available: - GR3-C3: 6th generation Intel® Core™ i3-6102E - GR3-X7: 5th generation Intel® Core™ i7-5700EQ Supports NVIDIA® CUDA® and OpenCL™ 1.2 640 CUDA cores, 1.271 TFLOPs shader performance 4GB GDDR5 graphics memory DirectX® 12, OpenGL® 4.5, Shader 5.0 8 or 4 lane PCI Express 2.0 DVI, VGA and DisplayPort outputs on VPX P1/P2 Two 1Gbps Ethernet, Two USB 2.0, Two RS-232 and Two SATA Long term product availability Ideal for rugged applications Windows or Linux drivers Contact us for the latest datasheet

Supports 5th generation (Broadwell-H) and 4th generation (Haswell) Intel® Core™ i7 processors XMC (VITA 42) module Conduction or air cooling Up to 8 GB of DDR3L-1600 ECC SDRAM in two channels Up to 32 GB of NAND flash Two x4 or one x8 PCI Express Gen3-capable P15 XMC interface One x4 PCI Express P16 XMC interface Two Gigabit Ethernet ports Four USB 2.0 ports Two SATA ports Two RS-232/422/485 serial ports HDMI/DVI-D or Dual-Mode DisplayPort interface Intel® vPro™/AMT support Linux BSP Microsoft Windows drivers Contact Sarsen for availability of Green Hills INTEGRITY, QNX Neutrino, Wind River VxWorks and LynuxWorks LynxOS BSPs  See Datasheet