Showing posts with label Core i7. Show all posts
Showing posts with label Core i7. Show all posts

Wednesday, 28 February 2018

Embedded World 2018 - Highlights from Nuremberg



From 27 February until the end of the day tomorrow the focus is once again on all things embedded.

The embedded technology community has joined together at the Nuremberg Exhibition Centre to shine a spotlight exclusively on the latest trends in the sector, with more than 1,000 exhibitors presenting state-of-the-art covering all aspects of embedded systems.

This year Mike Blee from Sarsen Technology is joining representatives from ECRIN Systems, VersaLogic and DAVE Embedded Systems to showcase all the latest and greatest innovations from these market leading companies.


ECRIN Systems

www.ecrin.com

Hall 2 - Stand 449 This is the first time ECRIN Systems has exhibited at Embedded World.


The new µONYX SWaP-C rugged system, based on the Intel Core i7 Skylake SoC will be on display, alongside their VPX COTS Boards, Mil-COTS and rugged systems.

Embedded World will also be the first time visitors can see the brand new myOPALE modular system. myOPALE provides a simple solution for applications that need more I/O boards than can be fitted in a standard Industrial PC based on backplane PCB.

VersaLogic

www.versalogic.com

Hall 3 - Stand 259 VersaLogic Corporation is the trusted name in embedded computer products. Featuring 5 to 10 year availability, -40 to +85° C operating temperature, MIL-STD 202G shock and vibration testing, and outstanding US-based support, VersaLogic products are ideal for critical applications that value ruggedness, reliability and long life.

VersaLogic will be officially introducing their newest embedded computer product line at Embedded World. Built around ARM processors for low power, lower performance requirements using the COM Express form factor (95x125 mm), the EPC line offers designed in reliability and is validated to withstand extreme temperatures and high-impact/vibrations. The first board in the EPC family is the rugged Tetra (VL-EPC-2700)
DAVE Embedded Systems

www.dave.eu

Hall 4 - Stand 481 DAVE Embedded Systems is a well-established Italian company, focussed on the design of highly complex miniaturised embedded electronic systems.

This year DAVE Embedded Systems is celebrating their 20th anniversary, so join them at embedded world 2018 where they will be showcasing their past and present solutions with a new booth design. Their latest technology successes includes the Xilinx Zynq-based BORA SoM and their new range of single board computers.



Embedded World 2018 Photos:

DAVE Embedded - Hall 4 Stand 481

ECRIN Systems - Hall 2 Stand 449

Mike Blee from Sarsen Technology supporting DAVE



Monday, 10 April 2017

ONYX-HD: High Performance Embedded Computing Platform for Video Imaging and Situation Awareness


Pre-Qualified Multi-Mission Rugged Computer

 
The ONYX family from Ecrin Systems is based on leading edge multi-core Intel® Core™ i7  processing capabilities to support a wide variety of mission requirements. Pre-Qualified MIL-STD-810/461/1275/DO-160 and in a lightweight, conduction cooled chassis the ONYX is an ideal choice for space constrained applications and harsh environmental conditions.

ONYX-HD is unique: instead of the traditional, expensive multi-slot VPX architecture, ONYX is built around a scalable and rugged multi-Core COM Express module operating between -40°C/+71°C.

It pairs cutting edge heterogeneous system architecture with an Intel multi-core i7 and Xilinx Kintex 7 FPGA capture engine. This set up combined with the latest generation AMD E8860 GPU, dedicated to parallel image computing, means the ONYX HD comfortably meets a wide variety of civilian and military requirements needing advanced Augmented Reality features, including video and data management, digital maps, tactical video overlays and mission management systems.

In a departure from the original ONYX system there is no XMC I/O module limited to PCIe 8Xlinks, but a high performance GPGPU dedicated MXC mezzanine with PCIe 16X Gen 2 links offering up to 8 GB/s bandwidth and a large choice of Digital and Analogic I/O video formats, from legacy STANAG up to new generation HD-SDI and 3G-SDI.
The added H.264 compression via Quick Sync from Core i7 means ONYX-HD is perfectly designed for UAVs or helicopter HD Video situation awareness missions.

See Datasheet

Details:


INTEL Multi-Core i7 + KINTEX 7 + AMD E8860 with up to 768 GFLOPS GPGPU engine PMC and mini PCI Express sites for flexible I/O expansion and Wireless functions
2 x HD-SDI inputs SMPTE-292M, 1920x1080p30 Cable-free, Fanless, MIL-DTL-38999 connectors
2 x simultaneous HD-SDI outputs SMPTE-292M, 1920x1080p30 Real cold start at -40°C and up to +71°C Operating Temp (depends on configuration and cooling system)
2 x Analog NTSC/PAL inputs for legacy sensors Standard BOM Qualified DO-160F and MIL-STD-810G/461F/1275D/704
1 x VGA + 1x DVI-D Single Link (Intel HD Graphic) IP-67 Ingress
H.264/AVC video Encoding with streaming capabilities ITAR free without Export Control
Linux Metadata Extraction/Insertion Only 80 Watts Power consumption
Embedded EGNOS-capable GPS High flexibility to Modified COST services


For more information please contact Sarsen Technology - +44 1672 511122


Tuesday, 16 August 2016

Intel Developer Forum - 16th-18th August 2016

The Intel Developer Forum offers everything you could possibly need to make sure you're at the forefront when it comes to the latest technology.

As well as a world class forum schedule, including a keynote address from Brian Krzanich, the Technology Showcase offers you unprecedented access to the world’s most exciting products. You'll have the opportunity to ask your toughest questions, or find an ingenious solution to your design challenges.

Ready to meet you at the IDF will be the team from Extreme Engineering Solutions (X-ES). You will find them on stand #730, where you'll be among the first to see the latest and greatest embedded boards and solutions, based on Intel's Xeon D, Atom E3800 and Core i7 processors.

https://www.xes-inc.com/embedded-technologies/intel-processor-technology/
Click the button to find out more about the rugged Intel-based boards from X-ES.



___________________________________________________________________________________________________

With the acquisition of Altera by Intel, the Altera SoC Developer Forum (ASDF) is now the Intel SoC FPGA Developer Forum (ISDF). ISDF is dedicated to the technology and application of SoC FPGAs across a wide range of design areas, including networking and communications, data centre and cloud computing and the Internet of Things (IoT).

The theme of this year's event is Acceleration:
  • Accelerate your design - with hardware acceleration in SoC FPGAs
  • Accelerate your development process - with leading edge design tools and ecosystem support
  • Accelerate your learning - by attending ISDF 2016
The ISDF16 event is taking place on day 3 of the Intel Developer Forum, and our friends at BittWare will be there showcasing the new Altera Arria 10 PCIe board platforms alongside their OpenCL solutions, including the popular OpenCL Bundle . The bundle includes a BittWare Arria 10 or Stratix V FPGA-based PCIe board, board support package, BittWorks II Toolkit-Lite system development software, Altera Quartus II software, and the Altera SDK for OpenCL.


For more information about the IDF, ISDF or any of the products from BittWare or X-ES please get in touch with the Sarsen Technology engineering team on +1672 511166 or send us an email - info@sarsen.net

Friday, 24 April 2015

VersaLogic EBX Single Board Computers - The Next Generation


Author - Laura

As part of their ongoing mission to provide reliable, cutting edge Single Board Computers (SBC) for the most demanding applications, VersaLogic has introduced two new EBX format boards.

Designed as a migration path for the Mamba, Python and Sidewinder boards, which are all now in the End of Life phase of their life cycle, the Anaconda and the Copperhead both offer a variety of I/O interfaces, multiple expansions buses, and thermal management options providing systems designers with flexibility and lower overall system cost.


http://versalogic.com/products/DS.asp?ProductID=231
http://versalogic.com/products/DS.asp?ProductID=255

VersaLogic's embedded computers are designed for the most demanding applications. From ultra small (credit card size) to industry-standard PC/104, EPIC and EBX format boards, their x86 compatible computers are used whenever reliability counts. They thrive in the harshest environments including temperature extremes (-40° to +85°C), shock, vibration, and humidity.

All VersaLogic computers are x86 compatible, allowing you to use standard Windows or Linux operating systems and your familiar development tools to create applications. Careful design and parts selection enables VersaLogic to manufacture most products for 5 to 10 years. VersaLogic backs every product with a 5-year minimum production life guarantee, as well as an industry leading 5 year warranty on all SBCs and expansion modules.

For more information please contact Sarsen Technology on +44 1672 511166 or send us an email.

Thursday, 20 November 2014

X-ES Recognised by Brigadier General L. Neil Thurgood for Outstanding Support

Author - Laura Biddiscombe

We'd like to wish everyone at Extreme Engineering Solutions a huge congratulations on their recent visit from Brigadier General L. Neil Thurgood, in recognition of their support for the Army’s Missiles and Space program.




General Thurgood and his staff traveled to Middleton, Wisconsin to personally thank X-ES and present eight individual certificates of appreciation, recognsing the employees directly involved with the delivery and outstanding support of the rugged Intel® Core™ i7-based Single Board Computers (SBCs) used for his program.

Read Full Press Release

_____________________________________________________________________________________________________

X-ES supports the Intel® Core™ i7 processor for a number of different form factors and rugged systems. These include:
  • 3U VPX XPedite7570
  • 6U VPX XCalibur4540
  • 3U cPCI XPedite7530
  • 6U cPCI XCalibur4500
  • 6U VME XCalibur4530
  • COM Express XPedite7450
See Full Product List
_____________________________________________________________________________________________________
About Extreme Engineering Solutions, Inc. 
(X-ES)is a 100% U.S.A.-based company, designing and manufacturing Intel® and Freescale-based single board computers, networking products, power supplies, and system-level solutions for embedded computing customers. X-ES offers cutting-edge performance and flexibility in design, plus an unparalleled level of customer support and service.

Tuesday, 4 June 2013

X-ES Announces 4th Generation Intel® Core™ i7 Processor Support Across Seven Industry Standard Form Factors

It's official. You heard it here first....

Our friends at Extreme Engineering Solutions, Inc. (X-ES) have introduced their new family of SBCs based on the 4th generation Intel® Core™ i7-4700EQ processor (formerly codenamed "Haswell").


We are all very excited about this news, as the 4th Gen Intel Core i7 processor has some serious advantages, including increased raw processing performance per watt, hardware-based memory encryption with Intel® AES New Instructions (AES-NI), and increased floating-point and integer performance utilising Intel® Advanced Vector Extensions 2.0 (AVX 2.0). The GPU has also been enhanced, adding additional execution units and up to a 24% increase in raw performance.

If that isn't enough for you, the 4th generation Intel Core i7 processor also supports OpenCL 1.2, allowing it to perform as a general-purpose graphics processing unit (GPGPU).


One size doesn't fit all...
Variety is the spice of life, so X-ES has incorporated the new Intel Core i7 processor on a range of form factors, including 3U VPX, 6U VPX, XMC, 3U CompactPCI, 6U CompactPCI, 6U VME, and COM Express. The new line up of conduction and air-cooled 4th generation Intel Core i7 products from X-ES includes the XCalibur4500 6U cPCI, the XCalibur4530 6U VME, and the XCalibur4540 6U VPX modules, which maximise I/O capabilities and add configurability with two PMC/XMC sites.

They have also introduced the XPedite7570 3U VPX and XPedite7530 3U cPCI modules - ideal for space constrained aerospace and vehicle platforms that require maximum processing performance and I/O capabilities, with the flexibility of PMC and XMC support. For applications with extreme size, weight, and power (SWaP) challenges X-ES also offers the XPedite7501 XMC and XPedite7550 Rugged COM Express modules.

XCalibur4530 from X-ES

For more information about the new boards from X-ES, featuring the 4th Generation Intel Core i7 processor, please give us a call on +44 1672 511166, or email the sales team at sales@sarsen.net

Wednesday, 17 April 2013

XPand 6103 - Intel Core i7 COM Express Embedded Box PC from Extreme.... Perfect for Transportation Applications!

The shiny new (well, actually, its matte black, but new things do tend to be shiny) XPand6103 from Extreme Engineering Solutions (X-ES) has been specifically designed for rugged and processing intensive vehicle and rail transportation applications.

The XPand6103has been designed for vehicle and rail applications

As one of the smallest and most rugged fanless embedded box PCs on the market, the XPand6103 is ideally suited for environmentally challenging and space constrained situations - underwater, in the sky, underground, in hot, sweaty signal boxes, in freezers..... the possibilities are virtually limitless. And it has the approvals to, well, prove it! IEC61373, EN50155, and MIL-STD-810 shock and vibration requirements as well as the water immersion requirements of IP67.

XPand6103 from X-ES

The XPand6103 supports the 3rd generation Intel Core i7 processor by integrating the XPedite7450 rugged COM Express module.

The standard configuration includes:
  • 3rd generation Intel® Core™ i7 processor
  • Rugged M12 I/O connectors
  • Gigabit Ethernet x 2
  • CAN Bus x 4
  • DisplayPort++ video
  • USB 2.0
  • RS-232/422 serial
  • 3 x PCI Express Mini Card expansion slots
  • -40°C to +70°C operating temperature
The system can also be configured to provide up to two 10 Gigabit Ethernet 10GBASE-T interfaces.

Did we mention it was rugged?

The XPand6103 can be used successfully in a huge range of transportation applications, without the need for additional power conditioning. This is achieved by supporting a wide nominal input voltage range, and complying to the power specifications of SAE J1455, EN50155, ISO-7637-2, MIL-STD-1275, and MIL-STD-704.

For more information on the XPand6103, or any of the X-ES product range please get in touch. You can call us on +44 1672 511166, or drop us an email!

Wednesday, 13 February 2013

Something lovely in the post this week!

As a reflection of the Sarsen Teams’ hard work in promoting their 5 newest boards VersaLogic have gifted us some delicious Domaine Drouhin Oregon Pinot Noir. Their Pinot noir bottlings are frequently awarded "Outstanding" scores from the Wine Spectator and Wine Advocate critics, so I’m sure it will pass the taste test with our educated palates!

Thanks to VersaLogic for our lovely wine!

A Little Bit of History
Established in 1987, Domaine Drouhin Oregon is owned by famed Burgundy producer, Maison Joseph Drouhin. Hand-crafted by fourth generation winemaker, Veronique Drouhin-Boss, the distinctive Pinot Noirs and Chardonnays of Domaine Drouhin are prized for their elegance, balance and finesse, as well as their ability to age. Ninety acres of the 225-acre estate are now planted, with over 3100 vines per acre.

VersaLogic manufacture a range of rugged industrial computers, designed for embedded applications across a variety of markets.
The latest boards cover the complete form factor range available from VersaLogic.
Tiger – VL-EPM-24 – PC/104 with Intel Atom Z5xx processor
Iguana – VL-EPIC-25 – EPIC with Intel Atom D525 or D425 processor
Copperhead – VL-EBX-41 – EBX with Intel Core i7 processor (quad or dual core)
Newt – VL-EPIC-17 – EPIC with Vortex86DX processor
Falcon – VL-EPU-2610 – EPU, based on COM Express Mini, with Atom E6*0T processor

For more information please give us a call on +44 1672 511166 or drop us an email.

Friday, 7 December 2012

Sarsen Technology is here if you need us, Santa!

Things are ramping up at the North Pole....

On the run up to Christmas Eve, Santa has to go through his list of names, and check it twice, to see who has been naughty and who has been nice. He then has to decide which toy each child deserves. It’s a long process, and it could be much simpler, using BLITzEN – the BittWare Low latency Intelligent Toy Evaluation Network.



It’s based on the Altera Stratix V FPGA, provides CPU offload, the highest performance transceivers , and with maximum processing performance per watt to minimize energy and thermal requirements it’s perfect for Santa’s busy Workshop, as it helps him to determine not just what children want but rather what they deserve.


Those Reindeer are an essential part of the process, and Santa knows he needs to make sure they are happy and performing at their best. The UEI Cube is small and rugged, and can be used to measure the tension on their specially adapted harnesses using its strain gauge layers, so Santa knows the second there are any problems. That sleigh is heavy!


Flying around the world in a reindeer-drawn sleigh would be made much easier with a display system running on the Copperhead Core i7 EBX board from VersaLogic. Its performance level allows for the integration of multiple high-bandwidth functions, such as digital signal processing and real-time video processing. The Copperhead features a high-speed memory interface, up to 16 GB on-board RAM capacity, and three independent display outputs, so Santa can check his route, run his aforementioned naughty-or-nice list, and still video-chat with the sleigh-port, an underground facility run by Elves that serves as a command and control centre. 

Phew! Its a busy time for the guys and girls at the North Pole, but don't worry Santa, Sarsen Technology is here to help. Give us a call on +44 1672 511166 or drop us an email!!

Monday, 5 November 2012

Whats new? Intel Core i7 and Freescale based Embedded SBCs from Extreme Engineering!

In the last 3 months, Extreme Engineering has released a host of brand new boards. From COMe to VPX, they offer solutions for a variety of applications.
 
The XPand6104 is a natural convection cooled small form factor system supporting the XPedite7450 Intel® Core™ i7 processor rugged COM Express module. An Ethernet port, two serial ports, a USB port, graphics port, and a SATA port from the XPedite7450 are brought out to standard commercial connectors on the front panel.

XPand6104

The XCalibur4440 is a high-performance, 6U VPX, multiprocessing, single board computer that is ideal for ruggedized systems requiring high bandwidth processing and low power consumption. Supporting 2nd generation Intel® Core™ i7 processors and 3rd generation Intel Core i7 processors the XCalibur4440 delivers enhanced performance and efficiency for today's network information processing and embedded computing applications.

XCalibur4440


The XPedite5650 is a ruggedized COM Express mini module (55 mm x 84 mm) that supports an enhanced Type 10 pinout. With four PowerPC e500mc cores running at up to 1.5 GHz, the P2041 delivers enhanced performance and efficiency for today's network information processing and other embedded computing applications. There are plenty of I/O ports, including one copper Gigabit Ethernet port, a single x2 PCIe port, two x1 PCIe ports, two USB 2.0 ports and two SATA 3.0 Gb/s ports.

XPedite5650


The XCalibur4402 is a high-performance, 6U CompactPCI, multiprocessing, single board computer, supporting Supports 2nd generation Intel® Core™ i7 processors and 3rd generation Intel Core i7 processors. The XCalibur4402 provides up to 16 GB of DDR3-1600 ECC SDRAM in two channels, two PrPMC/PrXMC slots, 32 MB of NOR flash, and up to 128 GB of NAND flash. 

XCalibur4402


X-ES offers the widest range of commercial and ruggedized 3rd Gen Intel Core i7 processor solutions for embedded applications. As the UK distributor for X-ES we can help with any questions you may have.

Please give us a call on +44 1672 511166 to discuss your application, or email us!

Friday, 21 September 2012

Supporting the 3rd Gen Intel Core™ i7 Processor Across Eight Industry-Standard Form Factors....

Extreme Engineering Solutions, Inc (X-ES) has remained at the forefront of leading edge technologies over the years, by developing numerous designs based on Intel® Pentium®, Core™ Duo, Core™2 Duo, and Atom™ processors.

 
Continuing in this tradition, X-ES has embraced the embedded Intel® Core™ i7 processors and had design experience with the (first generation) Intel Core i7 processor, the 2nd generation Intel Core i7 processor, and the 3rd generation Intel Core i7 processor.
The 3rd generation Intel Core i7 processors are the first chips in the world made using Intel’s 22-nanometer (nm) 3-D tri-Gate transistor technology. This generation Intel Core i7 processor provides up to twice the HD media and 3-D graphics performance, as well as significant processor performance improvements over the previous generation of Intel Core i7 processors.
X-ES has coupled this revolutionary processor technology with the Intel® QM57 Express and  QM67 Express chipsets, low-power interface controllers. These power-efficient devices offer integrated PCI Express, USB, SATA 3.0 Gb/s, and graphics interfaces. The Intel Core i7 processor coupled with the Intel QM57/QM67 Express chipset provides high performance within an embedded power budget.
The XPedite7470 3U VPX SBC and the XCalibur4401 6U CompactPCI SBC were the first products available from X-ES to support the 3rd Gen Intel Core i7 processor, and
X-ES is supporting the 3rd Gen Intel Core™ i7 Processor across eight industry-standard form factors:
  • COM Express
  • 3U VPX
  • 6U VPX
  • 3U CompactPCI
  • 6U CompactPCI
  • VME
  • Air-cooled PrPMC/XMC
  • Conduction-cooled PrPMC/XMC

For more information on these or any X-ES products please give us a call on +44 1672 511166 or email us: info@sarsen.net

Have a great weekend!
 

Friday, 7 September 2012

Things that have interested the Sarsen Team this week....



In no particular order -

Cake.
Fancy dress parties Something beginning with ‘F’ anyone?
Old money 12p = a shilling = 5p. Hmmm. 
Cockney Rhyming Slang

The XPedite7470 from Extreme Engineering (X-ES).

The XPedite7470 is a high-performance, low-power, 3U VPX-REDI, single board computer. It's based on the 2nd generation Intel® Core™i7 processor or 3rd generation Intel Core i7 processor and Intel QM67 chipset, and can be used in either the system slot or peripheral slot of a VPX backplane. Floating-point-intensive applications such as radar, image processing, and signals intelligence will benefit from the performance boost provided by the Intel® Advanced Vector Extensions (Intel® AVX) incorporated into the 2nd generation Intel Core™i7 processor. 

XPedite7470 from Extreme Engineering Solutions, Inc (X-ES)

This board has caught the attention of many design engineers and developers, because it’s ideal for the high-bandwidth and processing-intensive demands of today's military and avionics applications. 
Please contact Sarsen Technology for full details of the air-cooled and conduction-cooled variants of the XPedite7470 available. 
T +44 1672 511166      E - info@sarsen.net


The Sarsen Team would also like to congratulate Dan at BittWare on his upcoming nuptials this weekend. Best wishes to Dan from all of us!