Showing posts with label x-es. Show all posts
Showing posts with label x-es. Show all posts

Monday, 11 March 2019

Rapid Growth Fuels X-ES Move to New Corporate Headquarters

To accommodate their continuing growth, the lovely people at Extreme Engineering Solutions (X-ES) have moved to a fabulous new corporate headquarters in Verona, WI.

Completed in September of 2018, the combined office and manufacturing space is located at 9901 Silicon Prairie Parkway, approximately six miles from the company’s previous headquarters in Middleton, WI.

The new 126,200 sq. ft. facility is a significant upgrade from the 50,000 sq. ft. Middleton facility. The new building offers more office space and improved amenities for employees and customers, including more than twice the meeting space.


The design by KEE Architecture features a central atrium and clerestory windows that provide abundant natural light to offices and common areas. The building is situated on a green and open 13.8 acres, leaving ample room to grow as the company continues to expand.

Nearly half of the new facility is devoted to a state-of-the-art manufacturing space, where X-ES performs final product assembly, integration, and testing.

The 60,000 sq. ft. manufacturing area is temperature-, humidity-, and ESD-controlled, and as part of this expansion X-ES has acquired 165 new workbenches, six new thermal chambers for temperature testing, and one new shaker for shock and vibration testing.


To achieve ambitious goals for long-term energy savings, X-ES worked with the Wisconsin Focus on Energy Business Incentive Program to incorporate equipment and practices that reduce energy waste, such as network lighting controls and energy-efficient heating and cooling equipment. The estimated electricity savings over the life of the equipment is more than eight million kilowatt hours, and the estimated lifecycle natural gas savings equates to almost 49,000 gallons of gasoline.

If you'd like more information about X-ES please send us an email. 

Thursday, 3 January 2019

Brand New Small Form Factor (SFF) System Features 10 Gb/s Optical Links for High-Bandwidth Embedded Computing

The latest 3U VPX embedded system from Extreme Engineering Solutions (X-ES) sets a new standard for high-bandwidth data acquisition and signal processing in harsh environments.

With multiple high-speed optical links, an Intel® Xeon® D-1500 processor, and a Xilinx Kintex® UltraScale™ FPGA, the XPand6215 offers uncompromising performance and reliability in a SWaP-optimised two-slot system.


High-Speed, Fibre Optic Communications
The XPand6215 is a commercial-off-the-shelf (COTS) rugged chassis hosting two conduction-cooled 3U VPX modules. One slot contains the XPedite2570, a reconfigurable fibre-optic I/O module based on the Xilinx Kintex® UltraScale™ family of FPGAs.

The XPedite2570 supplies 12 protocol-independent optical transceivers operating at up to 10.3125 Gb/s, along with 8 GB of DDR4 ECC SDRAM in two channels capable of up to 38 GB/s aggregate bandwidth. The transceivers utilise 50/125 μm multi-mode fibre with MT connectors and are qualified over the full -40°C to +85°C industrial temperature range for reliable performance in extreme environments.

These optical links are paired with a user-programmable Xilinx Kintex® UltraScale™ FPGA, which provides a blend of performance and cost-effectiveness that is ideal for packet processing and DSP-intensive processing in embedded applications.

Unparalleled, Multi-Core Processing Power
The other slot of the XPand6215 contains the XPedite7670, a 3U VPX Single Board Computer based on the Intel® Xeon® D-1500 family of processors (formerly Broadwell-DE). Available with up to 16 Xeon®-class cores in a single, power-efficient System-on-Chip (SoC) package, this processor puts the XPand6215 in the upper echelon of embedded system performance. Xeon® D processors with up to 12 cores offer native extended temperature support with an operating temperature range of -40⁰C to +85⁰C.

The XPedite7670 also provides up to 16 GB of DDR4-2133 ECC SDRAM, while an XPort3305 10 Gigabit Ethernet XMC module installed on the XPedite7670 provides a rugged 10GBASE-SR Ethernet port.

Industry-Leading Functional Density in a Small Form Factor (SFF) Enclosure
The XPand6215 makes the most of every pound and square inch, packing maximum functionality into a streamlined two-slot design. Its integrated 28 VDC power supply eliminates the need for an additional power supply slot. It also includes a memory bay for a removable 2.5 in. solid-state drive (SSD), adding the option for up to 1 TB of storage. Fully loaded, the system weighs approximately 4kg, making it ideal for cutting-edge military and industrial applications that require small, lightweight solutions.

Qualified to the MIL-STD-461E/F, MIL-STD-810, and MIL-STD-704F standards, the XPand6215 has passed a battery of tests to ensure reliable operation in even the most challenging environments.

The XPand6200 Series of rugged, embedded systems are available in a diverse range of configurations, making them uniquely-suited to a variety of processing-intensive applications.

Please contact Sarsen Technology to discuss your requirements.

Monday, 6 August 2018

Obsolescence Management for Rugged, Embedded Computers

We are fortunate to work with a lot of really great companies across the entire globe, and Extreme Engineering is one of the best.

Extreme Engineering Solutions (X-ES) is a world leader in the design, manufacture, and support of embedded computing solutions for compute-intensive military, communications, commercial, and industrial applications, provides a product portfolio of commercial-grade to fully ruggedised boards and systems.

The X-ES product line features the very latest in Xilinx FPGA, ARM Cortex, Intel i7 technology and NXP PowerPC processors. SBCs from X-ES are available in a number of form factors - 3U and 6U rugged VPX boards, XMC, VME, CompactPCI and 6U LRM.

See more - XES Products

Their specialty is custom services, from modified COTS to full-scale custom designs, getting you the technology you need in the shortest possible time frame. All of X-ES' products are backed by the best possible customer support, from both X-ES and their global distribution network, and they are committed to providing full life cycle support for their products.

To provide customers with information, flexibility, and control over the products they depend on, X-ES offers three configuration and obsolescence management options.


Level 1 - Change Notice Level 2 - Change Control Level 3 - Life Cycle Control
All customers have access to a complimentary Change Notice. Any time a Major (Class I) Engineering Change Order (ECO) occurs, X-ES will issue a Product Change Notification (PCN) and then post it to the X-ES online customer information resource, SupportNet.

To be automatically notified of such changes, customers may also subscribe to email notifications of updates to SupportNet.
For customers who need to closely manage changes to their product’s design, X-ES offers Change Control.

Under this upgraded configuration management option, designated customer contacts will receive notification for all Major (Class I) ECOs.

They then have the option to accept or reject those changes.
Life Cycle Control includes configuration and obsolescence management, ideal for customers with long project lifecycles.

Along with the Change Control configuration management offered in Level 2, X-ES proactively monitors obsolescence notification sources and issues an obsolescence notification form to designated customer contacts. Life Cycle Control provides options to lengthen the life of projects as products age and their components reach End-of-Life (EOL).

When an obsolescence notification is issued, X-ES provides an impact assessment, along with details for last-time buys of components, substitute components, and product replacements/ re-designs as appropriate, thus ensuring product availability for several years to come.

For more information please contact Sarsen to discuss your application with one of our engineers.

Thursday, 10 May 2018

Extreme Engineering Releases 3U VPX Xilinx Kintex UltraScale FPGA Module

Extreme Engineering Solutions (X-ES) introduces the XPedite2570, a rugged FPGA processing module with a high-speed optical front-end interface. Equipped with an integrated Xilinx Kintex® UltraScale™ FPGA, the XPedite2570 optimises both cost and performance for high-bandwidth embedded computing applications.

XPedite2570 Datasheet

Xilinx Kintex® UltraScale™ FPGA Delivers Great Performance Without Great Cost
The XPedite2570 is a high-performance, conduction-cooled 3U VPX FPGA processing module based on the Xilinx Kintex® UltraScale™ XCKU115 FPGA.

The Xilinx Kintex® UltraScale™ family of FPGAs provides the best price/performance/watt at 20nm, as well as the highest signal processing bandwidth for a mid-range device.

Ideal for programs that need to optimise both cost and capability, the Kintex® UltraScale™ XCKU115 packs over 1.4 M system logic cells, 5,520 DSP slices, and 75.9 Mb of block RAM into a cost-effective package. It also provides a straightforward upgrade path for legacy systems, offering up to 40% power savings compared to the previous generation of FPGAs.


Optimised for High-Bandwidth Applications
The XPedite2570 is a reconfigurable FPGA resource designed to meet the demands of high-bandwidth applications such as packet processing, signal processing, and DSP-intensive applications. It features 12 rugged, protocol-independent fiber optic transceivers operating at up to 10.3125 Gb/s, along with 8 GB of DDR4 ECC SDRAM in two independent channels capable of up to 38 GB/s aggregate bandwidth. The XPedite2570 has several options for high-performance backplane I/O, including a x8 Gen3 PCI Express interface, dual GTH transceivers with a maximum data rate of 16.375 Gb/s, and up to 44 LVDS transceivers for user I/O.

X-ES’ board support package for the XPedite2570 includes an FPGA Development Kit for Xilinx Vivado complete with a reference design, IP Integrator IP blocks, HDL, test benches, and Linux drivers, so developers can jump right into application development without having to work through hardware integration issues.

Build a Rugged COTS System with Compatible X-ES Products
For lower development costs and faster deployment, pair the XPedite2570 with a 3U VPX single board computer (SBC) and install them together in the XPand6215, a Commercial-Off-the-Shelf (COTS) rugged system designed to meet the rigorous standards of MIL-STD-704F and MIL-STD-461. The XPand6215 can support several embedded single board computers from the XPedite767x product line, such as the XPedite7670. This family of high-performance SBCs is based on the Intel® Xeon® D processor, which provides up to 16 Xeon®-class cores in a single, power-efficient System-on-Chip (SoC) package.

More about Extreme Engineering Solutions (X-ES)

Tuesday, 16 August 2016

Intel Developer Forum - 16th-18th August 2016

The Intel Developer Forum offers everything you could possibly need to make sure you're at the forefront when it comes to the latest technology.

As well as a world class forum schedule, including a keynote address from Brian Krzanich, the Technology Showcase offers you unprecedented access to the world’s most exciting products. You'll have the opportunity to ask your toughest questions, or find an ingenious solution to your design challenges.

Ready to meet you at the IDF will be the team from Extreme Engineering Solutions (X-ES). You will find them on stand #730, where you'll be among the first to see the latest and greatest embedded boards and solutions, based on Intel's Xeon D, Atom E3800 and Core i7 processors.

https://www.xes-inc.com/embedded-technologies/intel-processor-technology/
Click the button to find out more about the rugged Intel-based boards from X-ES.



___________________________________________________________________________________________________

With the acquisition of Altera by Intel, the Altera SoC Developer Forum (ASDF) is now the Intel SoC FPGA Developer Forum (ISDF). ISDF is dedicated to the technology and application of SoC FPGAs across a wide range of design areas, including networking and communications, data centre and cloud computing and the Internet of Things (IoT).

The theme of this year's event is Acceleration:
  • Accelerate your design - with hardware acceleration in SoC FPGAs
  • Accelerate your development process - with leading edge design tools and ecosystem support
  • Accelerate your learning - by attending ISDF 2016
The ISDF16 event is taking place on day 3 of the Intel Developer Forum, and our friends at BittWare will be there showcasing the new Altera Arria 10 PCIe board platforms alongside their OpenCL solutions, including the popular OpenCL Bundle . The bundle includes a BittWare Arria 10 or Stratix V FPGA-based PCIe board, board support package, BittWorks II Toolkit-Lite system development software, Altera Quartus II software, and the Altera SDK for OpenCL.


For more information about the IDF, ISDF or any of the products from BittWare or X-ES please get in touch with the Sarsen Technology engineering team on +1672 511166 or send us an email - info@sarsen.net

Monday, 8 June 2015

UPCOMING EVENTS!


Sarsen Technology takes part in various events throughout the year across a number of markets and technology sectors, sometimes as a visitor and quite often as an exhibitor. This is just a snapshot of our upcoming events, so if you would like more information please contact Laura Biddiscombe for details.

  • June 9th - VentureFest, Bristol - A one-day event showcasing Bristol and Bath’s most innovative and enterprising companies and start-ups. This is a free event, however you will need a ticket.

  • June 17thNMI Model Driven Engineering 2015 - As a member of NMI we get access to some great events. This one, held at Thales in Crawley, is mostly focussed on electronics and software domains, reflecting the interests of NMI members and guests.

  • September 15th-18th - DSEI 2015 - DSEI brings together the entire defence and security industry to source the latest equipment and systems, develop international relationships, and generate new business opportunities. Sarsen Technology will be exhibiting within the UK Pavilion on stand S4-453, where you can see an exciting range of embedded technology from BittWare, Ecrin Systems, Extreme Engineering, General Standards and Tech Source.

  • October 21st - 22nd - Embedded Design Show 2015 - Following last years' successful exhibition we are pleased to once again be taking part alongside the team from DAVE Embedded Systems. You can find us on Stand G32, where we will be showcasing the complete range of SoMs from DAVE Embedded Systems, based on FPGA technology, ARM Cortex-A architecture, Freescale and Texas Instruments processors and Xilinx SoC.

Thursday, 20 November 2014

X-ES Recognised by Brigadier General L. Neil Thurgood for Outstanding Support

Author - Laura Biddiscombe

We'd like to wish everyone at Extreme Engineering Solutions a huge congratulations on their recent visit from Brigadier General L. Neil Thurgood, in recognition of their support for the Army’s Missiles and Space program.




General Thurgood and his staff traveled to Middleton, Wisconsin to personally thank X-ES and present eight individual certificates of appreciation, recognsing the employees directly involved with the delivery and outstanding support of the rugged Intel® Core™ i7-based Single Board Computers (SBCs) used for his program.

Read Full Press Release

_____________________________________________________________________________________________________

X-ES supports the Intel® Core™ i7 processor for a number of different form factors and rugged systems. These include:
  • 3U VPX XPedite7570
  • 6U VPX XCalibur4540
  • 3U cPCI XPedite7530
  • 6U cPCI XCalibur4500
  • 6U VME XCalibur4530
  • COM Express XPedite7450
See Full Product List
_____________________________________________________________________________________________________
About Extreme Engineering Solutions, Inc. 
(X-ES)is a 100% U.S.A.-based company, designing and manufacturing Intel® and Freescale-based single board computers, networking products, power supplies, and system-level solutions for embedded computing customers. X-ES offers cutting-edge performance and flexibility in design, plus an unparalleled level of customer support and service.

Wednesday, 1 October 2014

XMC/PMC and Rugged COM Express modules for high-temperature environments introduced by X-ES

Author - Laura Biddiscombe

We have a little treat for you - the brand new XPedite8101 Express Mezzanine Card and PCI Mezzanine Card (XMC/PMC) and XPedite8150 Rugged COM Express modules from Extreme Engineering Solutions (X-ES) have been featured in an article written by the editor of Military & Aerospace Electronics, John Keller.

Based on the Intel Atom E3800 processor family (formerly Bay Trail-I) these embedded computing modules are designed and tested for maximum reliability in the most demanding environments and applications that require long life cycles.





X-ES supports the Atom E3800 processor in industry-standard XMC/PMC and Rugged COM Express modules, enabling system integrators to develop a single x86-based application on modular hardware solutions that can be tailored for the performance and environmental constraints of each platform.

The XPedite8150 Rugged COM Express Module from Extreme Engineering Solutions


For more information or to request a quote please contact Sarsen Technology on +44 1672 511166, or drop us an email.

Friday, 8 August 2014

Extreme Environments Demand Extreme Engineering Solutions - Rugged SBCs and Systems from X-ES

Author: Laura Biddiscombe

Extreme Engineering Solutions (X-ES) is a leader in designing advanced, embedded computing products for the harsh environments seen in military and industrial applications.

They utilise best-in-class design, test, and manufacturing practices to develop products that deliver reliable operation in the extremes of temperature, shock, vibration, and environment.

Three levels of ruggedization are available for X-ES products, supporting commercial, extended temperature, and conduction-cooled applications. Products may be air-cooled or conduction-cooled depending on the end application. These levels allow our customers to tailor a solution to their application by selecting the range that best suits their needs for thermal, vibration, shock and performance.

Standard Air-Cooled - Level 1
Operating Temperature 0 to +55°C ambient, 300 LFM, per MIL-STD-810F 501.4 Procedure II and Method 502.4 Procedure II
Storage Temperature -40 to +85°C ambient †
Vibration 0.002 g²/Hz, 1 hour per axis from 5 to 2000 Hz
Shock 20 g, 11 ms sawtooth, per MIL-STD-810F Method 516.5 Procedure I
Humidity 0% to 95% non-condensing, per MIL-STD-810F Method 507.4
Rugged Air-Cooled - Level 3
Operating Temperature -40 to +70°C, 600 LFM, per MIL-STD-810F 501.4 Procedure II and Method 502.4 Procedure II
Storage Temperature -55 to +105°C, per MIL-STD-810F Method 501.4 Procedure I and Method 502.4 Procedure I †
Vibration 0.04 g²/Hz (maximum), 1 hour per axis from 5 to 2000 Hz ‡
Shock 30 g, 11 ms sawtooth, per MIL-STD-810F Method 516.5 Procedure I
Humidity 0% to 95% non-condensing, per MIL-STD-810F Method 507.4
Conduction-Cooled - Level 5
Operating Temperature -40 to +85°C board rail surface temperature, per MIL-STD-810F Method 501.4 Procedure II and Method 502.4 Procedure II
Storage Temperature -55 to +105°C, per MIL-STD-810F Method 501.4 Procedure I and Method 502.4 Procedure I †
Vibration 0.1 g²/Hz (maximum), 1 hour per axis from 5 to 2000 Hz ‡
Shock 40 g, 11 ms sawtooth, per MIL-STD-810F Method 516.5 Procedure I
Humidity 0% to 95% non-condensing, per MIL-STD-810F Method 507.4

If an application does not fall into one of these three ruggedization levels, X-ES offers extended temperature, humidity, and vibration screening services. Many military designs, for example, have a -55ºC operational requirement. In the case where screening alone is not practical, X-ES has experience with heater tapes and other alternative solutions. Optional features, such as conformal coating, are available.

Contact the Sarsen Technology Technical Team for more information about available options.

Thursday, 7 November 2013

Extreme Engineering VPX VITA 62 Power Supplies

In today’s defense electronics environment, open standards are becoming increasingly critical to engineers to help them deal with the reality of regular and frequent technology upgrades.

The VPX (VITA 46) standard was developed in support of ruggedized, deployed applications and is the technology of choice for military applications where Size, Weight, and Power (SWaP) are an issue. VPX supports both 3U and 6U form factors, provides a large amount of high-speed I/O to the backplane, and enables the use of modules that require up to 200 watts of power.


Extreme Engineering Solutions (X-ES) has expertise in designing and delivering high-quality, efficient, clean power modules. Their VPX COTS power modules are designed to meet the rigors of high performance, deployed military applications. X-ES has been actively involved in the development of the VPX and OpenVPX standardisation efforts, and was one of the first companies to develop VPX products. They have been shipping VPX products since 2006.


The latest power module from X-ES is the XPm2220, which opens the door to reducing the total SWaP, cost, and complexity of VPX-based systems by providing a number of distinctive capabilities, including industry-leading output power and efficiency. It also provides direct support for a wide input voltage range, and fits within a single 0.8-inch or 1-inch pitch 3U VPX slot.


The XPm2220 takes in a MIL-STD-704 or MIL-STD-1275 28 VDC input voltage and provides up to 300W on 3.3V, 5V, and ±12V at up to 90% efficiency. The XPm2220 also provides on-card MIL-STD-461 EMI filtering and MIL-STD-1275 transient suppression.

For more information please contact the team at Sarsen Technology on +44 1672 511166, or drop us an email – info@sarsen.net

Friday, 2 August 2013

Defence and Aerospace Roadshow Confirmed Schedule

The schedule for the Dream Marketing Defence & Aerospace Roadshow has been confirmed.

Sarsen will be visiting all of the sites on the list, sharing some exciting technology from BittWare, Dave, Extreme Engineering, General Standards, Tech Source and Trenton Systems.

Look forward to seeing you there!

Mon 16th Sep - BAE Systems Barrow
Tues 17th Sep - Rolls-Royce - Derby
Wed 18th Sep - Rolls Royce - Derby
Thur 19th Sep - Selex ES - Basildon
Fri 20th Sep - Safran Power - Pitstone
Mon 23th Sep - Messier Dowty - Gloucester *TBC
Tues 24th Sep - GE Aviation - Cheltenham
Wed 25th Sep - Cobham Mission Systems - Wimborne
Thur 26th Sep - QinetiQ - Boscombe Down
Fri 27th Sep - General Dynamics - Newport
Mon 30th Sep - BAE/Airbus - Filton
Tues 1st Oct - Rolls Royce - Bristol
Wed 2nd Oct - L-3 Comms - Tewkesbury
Thur 3rd Oct - Agusta Westland - Yeovil



Check out Dream Marketing on LinkedIn

Tuesday, 4 June 2013

X-ES Announces 4th Generation Intel® Core™ i7 Processor Support Across Seven Industry Standard Form Factors

It's official. You heard it here first....

Our friends at Extreme Engineering Solutions, Inc. (X-ES) have introduced their new family of SBCs based on the 4th generation Intel® Core™ i7-4700EQ processor (formerly codenamed "Haswell").


We are all very excited about this news, as the 4th Gen Intel Core i7 processor has some serious advantages, including increased raw processing performance per watt, hardware-based memory encryption with Intel® AES New Instructions (AES-NI), and increased floating-point and integer performance utilising Intel® Advanced Vector Extensions 2.0 (AVX 2.0). The GPU has also been enhanced, adding additional execution units and up to a 24% increase in raw performance.

If that isn't enough for you, the 4th generation Intel Core i7 processor also supports OpenCL 1.2, allowing it to perform as a general-purpose graphics processing unit (GPGPU).


One size doesn't fit all...
Variety is the spice of life, so X-ES has incorporated the new Intel Core i7 processor on a range of form factors, including 3U VPX, 6U VPX, XMC, 3U CompactPCI, 6U CompactPCI, 6U VME, and COM Express. The new line up of conduction and air-cooled 4th generation Intel Core i7 products from X-ES includes the XCalibur4500 6U cPCI, the XCalibur4530 6U VME, and the XCalibur4540 6U VPX modules, which maximise I/O capabilities and add configurability with two PMC/XMC sites.

They have also introduced the XPedite7570 3U VPX and XPedite7530 3U cPCI modules - ideal for space constrained aerospace and vehicle platforms that require maximum processing performance and I/O capabilities, with the flexibility of PMC and XMC support. For applications with extreme size, weight, and power (SWaP) challenges X-ES also offers the XPedite7501 XMC and XPedite7550 Rugged COM Express modules.

XCalibur4530 from X-ES

For more information about the new boards from X-ES, featuring the 4th Generation Intel Core i7 processor, please give us a call on +44 1672 511166, or email the sales team at sales@sarsen.net

Wednesday, 17 April 2013

XPand 6103 - Intel Core i7 COM Express Embedded Box PC from Extreme.... Perfect for Transportation Applications!

The shiny new (well, actually, its matte black, but new things do tend to be shiny) XPand6103 from Extreme Engineering Solutions (X-ES) has been specifically designed for rugged and processing intensive vehicle and rail transportation applications.

The XPand6103has been designed for vehicle and rail applications

As one of the smallest and most rugged fanless embedded box PCs on the market, the XPand6103 is ideally suited for environmentally challenging and space constrained situations - underwater, in the sky, underground, in hot, sweaty signal boxes, in freezers..... the possibilities are virtually limitless. And it has the approvals to, well, prove it! IEC61373, EN50155, and MIL-STD-810 shock and vibration requirements as well as the water immersion requirements of IP67.

XPand6103 from X-ES

The XPand6103 supports the 3rd generation Intel Core i7 processor by integrating the XPedite7450 rugged COM Express module.

The standard configuration includes:
  • 3rd generation Intel® Core™ i7 processor
  • Rugged M12 I/O connectors
  • Gigabit Ethernet x 2
  • CAN Bus x 4
  • DisplayPort++ video
  • USB 2.0
  • RS-232/422 serial
  • 3 x PCI Express Mini Card expansion slots
  • -40°C to +70°C operating temperature
The system can also be configured to provide up to two 10 Gigabit Ethernet 10GBASE-T interfaces.

Did we mention it was rugged?

The XPand6103 can be used successfully in a huge range of transportation applications, without the need for additional power conditioning. This is achieved by supporting a wide nominal input voltage range, and complying to the power specifications of SAE J1455, EN50155, ISO-7637-2, MIL-STD-1275, and MIL-STD-704.

For more information on the XPand6103, or any of the X-ES product range please get in touch. You can call us on +44 1672 511166, or drop us an email!

Friday, 7 September 2012

Things that have interested the Sarsen Team this week....



In no particular order -

Cake.
Fancy dress parties Something beginning with ‘F’ anyone?
Old money 12p = a shilling = 5p. Hmmm. 
Cockney Rhyming Slang

The XPedite7470 from Extreme Engineering (X-ES).

The XPedite7470 is a high-performance, low-power, 3U VPX-REDI, single board computer. It's based on the 2nd generation Intel® Core™i7 processor or 3rd generation Intel Core i7 processor and Intel QM67 chipset, and can be used in either the system slot or peripheral slot of a VPX backplane. Floating-point-intensive applications such as radar, image processing, and signals intelligence will benefit from the performance boost provided by the Intel® Advanced Vector Extensions (Intel® AVX) incorporated into the 2nd generation Intel Core™i7 processor. 

XPedite7470 from Extreme Engineering Solutions, Inc (X-ES)

This board has caught the attention of many design engineers and developers, because it’s ideal for the high-bandwidth and processing-intensive demands of today's military and avionics applications. 
Please contact Sarsen Technology for full details of the air-cooled and conduction-cooled variants of the XPedite7470 available. 
T +44 1672 511166      E - info@sarsen.net


The Sarsen Team would also like to congratulate Dan at BittWare on his upcoming nuptials this weekend. Best wishes to Dan from all of us! 




Monday, 20 August 2012

Busy Little Beavers..... Embedded Applications keeping the Sarsen Team busy...


Now everyone is back in the office, and we are back to full capacity after the summer holidays, it’s time to start thinking about the next few months, and look at the projects that will be keeping us busy until Christmas and beyond! (Only 126 days to go!)

 

Our main focus is the High Speed Financial Trading market. BittWare’s Altera Stratix V FPGA PCIe hardware is optimised for this industry. With multiple lanes of 10GigE straight to the FPGA, and PCI Express Gen 2, combined with on-board memory and optional TOE, as well as additional built-in support for 40 GigE and PCIe Gen3, the financial industry has taken notice!

The new Falcon EPU release from VersaLogic means we are talking to people about all kids of applications, including Mil-Aero, Medical, Security, R&D and Robotics. It’s a really compact board, (around the size of a credit card, and weighing 40g) so it’s also a brilliant solution for use in for portable applications and unmanned systems where Size, Weight and Power consumption (SWaP) are critical design elements.

X-ES customers are also keeping us busy with enquiries, in particular about the XPm2020 and XPedite7470 boards. The 7470 is a high-performance, low-power, 3U VPX-REDI, single board computer based on the 2nd generation Intel® Core™i7 processor or 3rd generation Intel Core i7 processor and Intel QM67 chipset. The XPm2020 is a VITA 62-compliant 3U VPX power supply that takes in a MIL-STD-704 28V-DC input voltage and provides up to 300W on 3.3V, 5V, and ±12V at up to 90% efficiency. Both are available now.

Show and Tell….
We love talking about our products, and we have loads of sample boards we can show you, so If you would like one of our sales team to visit you onsite, to discuss how the products we sell can work in your applications, please give us a call on +44 1672 511166 to arrange a meeting.


Friday, 29 June 2012

The Friday Round-Up from Sarsen Technology...


It’s nearing the end of the working week, and it’s been a busy one for Sarsen Technology. With visits to key customers and new products to get excited about, we are looking forward to a busy summer….. when it arrives!

Some of the new products we have been talking about this week -

Our friends at Tech Source have announced the Condor3000x-cc; a new conduction cooled and rugged version of the Condor 3000x XMC card. The Condor 3000x-cc is a leading edge XMC form factor graphics/video card, based on AMD’s E6760 GPU, for use in applications that require very high-end graphics and computation in a rugged format. 
  
The XCalibur1600 from Extreme Engineering Solutions, Inc. (X-ES) is a high-performance, 6U cPCI, single board computer supporting Freescale QorIQ P3, P4, and P5 processors. With eight Power Architecture e500mc cores running at up to 1.5 GHz, the P4080 delivers enhanced performance and efficiency for high-en military, communications and industrial embedded applications.

And in other news….

Sarsen Technology has decided to support Debbie Simpson in her bid to conquer the Marathon des Sables, to raise money for Facing Africa Noma, a great charity helping children overcome the legacy of the devastating disease noma.

Tim Norris, one of our account managers, is off to ‘Les Alpes’ this weekend on a mountain-biking holiday. Break a leg Tim. Oh, wait….   Follow Tim on Twitter @Embedded_Tim

Sarsen Technology has a brand new line card. If you’d like one sent out to you contact us at info@sarsen.net

Have a wonderful weekend!