White Paper - Intel Stratix 10 MX Devices Solve the Memory Bandwidth Challenge

White Paper

Intel® Stratix® 10 MX Devices Solve the Memory Bandwidth Challenge

Intel has put together a new White Paper to explain how the brand new Intel Stratix 10 MX family will help customers efficiently meet their most demanding memory bandwidth requirements.

"Conventional memory solutions have limitations that make it difficult for them to meet next-generation memory bandwidth requirements. This white paper describes the emerging memory landscape that addresses these limitations.

The Intel® Stratix® 10 MX (formerly Altera® Stratix 10 MX) DRAM system-in-package (SiP) family combines a 1 GHz high-performance monolithic FPGA fabric, state-of-the-art Intel Embedded Multi-die Interconnect Bridge (EMIB) technology, and High Bandwidth Memory 2 (HBM2), all in a single package. The Intel Stratix 10 MX family helps customers efficiently meet their most demanding memory bandwidth requirements, which are not possible using conventional memory solutions.

This white paper describes the solution and explains how Intel Stratix 10 MX devices solve the memory bandwidth challenge for key end markets and applications."


Authors
Manish Deo
Senior Product Marketing Manager
Intel Programmable Solutions Group

Jeffrey Schulz
In-Package I/O Implementation Lead
Intel Programmable Solutions Group

Lance Brown
Senior Strategic and
Technical Marketing Manager
Intel Programmable Solutions Group

© 2017 Intel Corporation. All rights reserved.

Application Note - TenAsys / INtime plus UEI / PowerDNA : The perfect match for Real Time Simulation

Author - Laura Biddiscombe


United Electronic Industries (UEI) has a vast library of Technical Articles, Application Notes and White Papers, including the widely read "Everything You Ever Wanted to Know about Data Acquisition and Embedded Control"; an overview of key DAQ concepts for both experienced engineers and those new to data acquisition.

The latest addition to the library is an application story which gives a great insight into how TenAsys/INtime and PowerDNA can work together in a Hardware in the Loop system.

"There are few Real Time operating systems which can implement the RT processor on one platform, and there are few Non Real Time Operating systems to implement the operator interface on another platform.

We will describe here a way to partition a single platform to do both. The software is called INtime for Windows and is produced by TenAsys Corporation.

There are also Various I/O options to connect to the RT system – many vendors, each with its special way of connecting to the RT system and different API “philosophy” to access the specific I/O.

We will describe here an I/O system that supplies all the needed interfaces to the Electronic Unit via one (Ethernet) connection to the RT system, and with a unified Driver “philosophy”. The I/O equipment is called PowerDNA , and is produced by UEI Corporation."

For more information about UEI products and services available in the UK please contact Sarsen Technology on 01672 511166, or send us an email - info@sarsen.net.

New White Paper from Trenton Systems - 'Optimizing PCIe 3.0 Backplane Designs for Performance and Reliability'

As a leader in the design and manufacture of high-performance computing solutions, Trenton Systems has continued to support PCI Express, from 1.1 to 2.0 and now 3.0, also referred to as Gen3.

BPX8093 PCIe 3.0 BACKPLANE

With each generation performance has doubled. Total bandwidth for PCIe Gen3 now reaches 32GB/s, compared with just 8GB/s for PCIe 1.1.

Keen to share their knowledge with you, the team at Trenton has just released a brand new White Paper, which explores
all the issues that are critical for achieving optimal PCIe 3.0 backplane design, as well as the performance advantages and system configurability benefits that can be achieved through a proper PCIe 3.0 backplane implementation.

Topics in this whitepaper:

• PCIe 3.0 Enhanced Performance Opportunities
• High-Efficiency Encoding Scheme in PCIe 3.0
• Enhanced Transaction Layer Features
• Active Equalization Capabilities
• Active vs. Passive Approach to Design
• Jitter Control, Impedance and Signal Loss
• Real World Deployment Issues

Drawing will be held at a time TBD and the winner will be notified with their registered email address. Choice between prizes will be up to the recipient, and mailed via US postal mail.

All of the PCI Express Gen3 backplanes and single board computers designed by Trenton are made in the USA using long-life components, and carry an industry leading 5-year factory warranty.

For more information visit – www.TrentonSystems.com

Embedded Enviro-Tech - the way forward?

In recent years, scientists have been carefully examining the ways that people affect the environment.

Huge advances have been made in the technology we use for environmental monitoring, in particular the electronic devices used to monitor, control and conserve the natural environment and resources, and to curb the negative impacts of human involvement.

When it comes to harnessing renewable energy, increased operating efficiency is achieved when embedded computing platforms are tasked with monitoring and controlling assets such as wind turbines, solar panels and transmission grids.

Trenton Systems Inc supports Smart Grid applications with its range of embedded motherboards, SBCs and backplanes.

Mark Lovett of Trenton Systems has written a White Paper titled 'Embedded Computing Enables Smart Grid Technology'.
It's full of great info about how this technology area is helping shape the future of power generation and management.

Check it out here!

Have a great weekend, check back on Tuesday for our new Spotlight section. First up, Robbie Burns!!