myOPALE - Modular Building Blocks for AI on the Edge

ECRIN Systems designs and manufactures rugged VPX COTS Boards, Mil-COTS and rugged systems, and their core business is the integration of COTS building blocks from Open Standard form factors like PICMG 1.3, to achieve the best system performance at reduced cost and shortest time to market.

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One of their latest solutions is the myOPALE building block system, which provides truly disruptive technology to realise ambitious design goals for industrial computers that target size, weight, and power consumption (SWaP)-constrained operating environments.

The myOPALE modular concept is based on four key points, all inspired by open or de facto standards used in the embedded market. It eliminates the mechanical link between the CPU module and its I/O cards thanks to PCI Express Gen3-over- cable interconnection in a standard half-height 5.25-inch casing.

myOPALE datasheet

The design is based on COM Express Type 6 and integrates Embedded Low Power SKU’s with 10 years life support. In Skylake and Kaby Lake versions, Intel Core i7 or Xeon E3-1500 CPU with Chipset platforms are selected, which directly drive 24 PCIe Gen3 lanes as their expansion bus.

There are a wide range of configurations and options available. If you would like to discuss the myOPALE concept please contact us at info@sarsen.net.

ECRIN can provide a complete integrated computer with Environmental Qualification Tests passed and mandatory Certification stickers for domestic and export countries. ive 24 PCIe Gen3 lanes as their expansion bus.

New Concept Modular Computer Could Change The Way You Design Embedded Systems

myOPALE™ from ECRIN Systems offers disruptive technology designed to multiply the capabilities of your next embedded computers in a much smaller foot print, thanks to PCI Express® over Cable interconnectivity, and standard 5.25’’ building blocks with mini-SAS HD connectors.

For three decades, Industrial PC’s have tended to use one of two types of architectures from the Eighties: ATX/miniITX motherboard, or PICMG® passive backplane. In both cases, the CPU board and its I/O cards were physically and mechanically linked through a PCI Express PCB.

The myOPALE Concept was born from four simple concepts:

• - Break the mechanical link between the CPU and I/O cards, using PCI Express Over Cable interconnection;
• - Design with building blocks based on a standard 5.25’’ form factor;
• - Use widely deployed inter-connectivity standards from SNIA/SFF Technology Affiliate, encompassing cables, connectors, form factor sizes and housing dimensions;
• - Integrated thermal solution at building blocks level.

For more details, including datasheet and technical specs, please visit the myOpale page on our website or contact one of our engineers to discuss your application.