New Concept Modular Computer Could Change The Way You Design Embedded Systems

myOPALE™ from ECRIN Systems offers disruptive technology designed to multiply the capabilities of your next embedded computers in a much smaller foot print, thanks to PCI Express® over Cable interconnectivity, and standard 5.25’’ building blocks with mini-SAS HD connectors.

For three decades, Industrial PC’s have tended to use one of two types of architectures from the Eighties: ATX/miniITX motherboard, or PICMG® passive backplane. In both cases, the CPU board and its I/O cards were physically and mechanically linked through a PCI Express PCB.

The myOPALE Concept was born from four simple concepts:

• - Break the mechanical link between the CPU and I/O cards, using PCI Express Over Cable interconnection;
• - Design with building blocks based on a standard 5.25’’ form factor;
• - Use widely deployed inter-connectivity standards from SNIA/SFF Technology Affiliate, encompassing cables, connectors, form factor sizes and housing dimensions;
• - Integrated thermal solution at building blocks level.

For more details, including datasheet and technical specs, please visit the myOpale page on our website or contact one of our engineers to discuss your application.