Trenton Systems Introduces New Purley Platform Skylake-SP Host Boards

Intel's next-generation Xeon Gold and Silver processors (formally known as Skylake-SP) developed under the family code name 'Purley' have now been released and Trenton Systems is pleased to be  launching a range of new products based on this architecture.

The Intel Xeon Gold and Silver processors are supported on the new SEP8253 system host board (SHB). The SEP8253 is the latest module in Trenton Systems’ HDEC Series® High Density Embedded Computing family of backplanes, host boards and rugged aluminium 19” rackmount chassis.

A drop-in replacement for the popular HEP8225, the SEP8253 brings support for dual Intel Xeon Gold and Silver processors and 8 DDR4-2666 memory DIMMs for up to 1TB of memory to the HDEC platform. 

It delivers 88 lanes of PCI Express 3.0 to an HDEC Series backplane, delivering the ultimate in flexibility when designing COTS PCIe embedded computing solutions that take advantage of FPGA and GPU co-processors, fabric interfaces like 50 or 100GbE, Infiniband or NVMe storage. 

Onboard interfaces include 4 USB 3.0, 2 Gigabit Ethernet interfaces, 2, 10GbE interfaces, VGA and Serial COMM support, with 6 additional USB 3.0, 6 SATA/600 and various serial, USB 2.0, GPIO, fan speed monitoring and I²C bus signals passed to the backplane.

The SEP8253 single board computer is designed, built and integrated by Trenton Systems in the USA to exacting quality and longevity standards. All Trenton's board products with a 5-year warranty, 15 years of processor availability, and free, in-house, lifetime technical support.

Please visit the Trenton Systems website for more information: www.trentonsystems.com.