Wednesday 23 January 2019

Embedded World 2019 - Don't Miss These Exhibitors


embedded world 2019

From 26 - 28 February 2019 the focus will once again be on all things embedded.

The community comes together at the Nuremberg Exhibition Centre to shine a spotlight exclusively on embedded technologies. It reflects the trends in the sector with more than 1,000 exhibitors presenting state-of-the-art covering all aspects of embedded systems.

This year Sarsen Technology will be joining ECRIN Systems, VersaLogic and DAVE Embedded Systems to showcase all the latest and greatest innovations from these market leading companies.

For more information or to arrange a meeting at the show please get in touch - info@sarsen.net
 

Not To Be Missed

ECRIN Systems

www.ecrin.com
Hall 2 - Stand 449 Founded in 1976, Ecrin Systems' core business is the integration of COTS building blocks from Open Standard form factors like PICMG 1.3 to achieve the best system performance at reduced cost and shortest time to market.

Their Opale family of smart industrial PCs will be on display, alongside their VPX COTS Boards, Mil-COTS and rugged systems.

VersaLogic

www.versalogic.com
Hall 3 - Stand 257 VersaLogic Corporation is the trusted name in embedded computer products. Featuring 5 to 10 year availability, -40 to +85° C operating temperature, Mil Standard 202G shock and vibration testing, and outstanding US-based support, VersaLogic products are ideal for critical applications that value ruggedness, reliability and long life.

VersaLogic has a host of new technology to showcase at Embedded World, as well as some of their tried and tested boards and solutions including their Zebra ARM based i.MX6 board, which was recognided by EETimes.com as one of the top Single Board Computers of 2018!
DAVE Embedded Systems

www.dave.eu
Hall 4 - Stand 481 DAVE Embedded Systems is a well-established Italian company, focussed on the design of highly complex miniaturised embedded electronic systems.

Join DAVE at embedded world where they will be showcasing their past and present solutions and expaining their additional support services in detail. Their latest technology innovation is a new System on Module (SoM) based on NXP i.MX8 which will be introduced for the first time at the show.

Friday 11 January 2019

Zero Packet Loss Processing for Government Security Applications

Government market sectors like cyber security, intelligence, surveillance and secure communications have become increasingly important in recent times. They also come with a unique set of challenges when it comes to protection from criminal activity taking place across the internet.

These types of applications have to support the strictest security measures as well as aggressive data bandwidths. We work with Netcope Technologies to provide programmable hardware accelerators that guarantee wire-speed traffic processing with zero packet loss on 100G, 40G and 10G Ethernet.



In combination with ready-to-use firmware, these accelerators provide both per-packet and stateful filtering, which is a basic element of lawful interception and data retention systems.

Together with support for multiple network technologies(100G, 40G, 10G and 25G Ethernet), this protects future investments when moving to higher speeds. Specifically, Netcope Session Filter (NSF) implements smart pre-processing of network traffic, based on keeping track of network flows directly in hardware.

NSF surpasses competing solutions due to its ability to dynamically adjust the level of traffic details transferred to software. Smart cooperation between intelligent software and powerful hardware allows implementation of reliable interception systems for the highest-speed networks, which is not possible with conventional solutions.

For more information about how Netcope and Sarsen can support your Law Enforcement, Cyber Security or Intelligence applications please get in touch - info@sarsen.net

Thursday 3 January 2019

Brand New Small Form Factor (SFF) System Features 10 Gb/s Optical Links for High-Bandwidth Embedded Computing

The latest 3U VPX embedded system from Extreme Engineering Solutions (X-ES) sets a new standard for high-bandwidth data acquisition and signal processing in harsh environments.

With multiple high-speed optical links, an Intel® Xeon® D-1500 processor, and a Xilinx Kintex® UltraScale™ FPGA, the XPand6215 offers uncompromising performance and reliability in a SWaP-optimised two-slot system.


High-Speed, Fibre Optic Communications
The XPand6215 is a commercial-off-the-shelf (COTS) rugged chassis hosting two conduction-cooled 3U VPX modules. One slot contains the XPedite2570, a reconfigurable fibre-optic I/O module based on the Xilinx Kintex® UltraScale™ family of FPGAs.

The XPedite2570 supplies 12 protocol-independent optical transceivers operating at up to 10.3125 Gb/s, along with 8 GB of DDR4 ECC SDRAM in two channels capable of up to 38 GB/s aggregate bandwidth. The transceivers utilise 50/125 μm multi-mode fibre with MT connectors and are qualified over the full -40°C to +85°C industrial temperature range for reliable performance in extreme environments.

These optical links are paired with a user-programmable Xilinx Kintex® UltraScale™ FPGA, which provides a blend of performance and cost-effectiveness that is ideal for packet processing and DSP-intensive processing in embedded applications.

Unparalleled, Multi-Core Processing Power
The other slot of the XPand6215 contains the XPedite7670, a 3U VPX Single Board Computer based on the Intel® Xeon® D-1500 family of processors (formerly Broadwell-DE). Available with up to 16 Xeon®-class cores in a single, power-efficient System-on-Chip (SoC) package, this processor puts the XPand6215 in the upper echelon of embedded system performance. Xeon® D processors with up to 12 cores offer native extended temperature support with an operating temperature range of -40⁰C to +85⁰C.

The XPedite7670 also provides up to 16 GB of DDR4-2133 ECC SDRAM, while an XPort3305 10 Gigabit Ethernet XMC module installed on the XPedite7670 provides a rugged 10GBASE-SR Ethernet port.

Industry-Leading Functional Density in a Small Form Factor (SFF) Enclosure
The XPand6215 makes the most of every pound and square inch, packing maximum functionality into a streamlined two-slot design. Its integrated 28 VDC power supply eliminates the need for an additional power supply slot. It also includes a memory bay for a removable 2.5 in. solid-state drive (SSD), adding the option for up to 1 TB of storage. Fully loaded, the system weighs approximately 4kg, making it ideal for cutting-edge military and industrial applications that require small, lightweight solutions.

Qualified to the MIL-STD-461E/F, MIL-STD-810, and MIL-STD-704F standards, the XPand6215 has passed a battery of tests to ensure reliable operation in even the most challenging environments.

The XPand6200 Series of rugged, embedded systems are available in a diverse range of configurations, making them uniquely-suited to a variety of processing-intensive applications.

Please contact Sarsen Technology to discuss your requirements.