Did You Meet DAVE at the Embedded Design Show 2014?

Author - Laura Biddiscombe

We had a great time at the Embedded Design Show last week, and were lucky enough to meet some really interesting people. The show gave us a platform to introduce DAVE Embedded Systems to the UK market, and I think the reception was fantastic.

The biggest crowd pleaser was, by far, the BORA. This little board is a Dual Cortex-A9 + FPGA CPU module based on the recent Xilinx "Zynq" XC7Z010 / XC7Z020 application processor. At just 85mm x 50mm the BORA helps customers save time and resources by providing a compact solution that includes both a CPU and an FPGA, avoiding complexities on the carrier PCB.

The BORA is suitable for high-end applications such as medical instrumentation, advanced communication systems, critical real-time operations and safety applications.

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Not only is the BORA a great platform to design your system around, DAVE makes it even easier to start your development by offering the the Bora Embedded Linux Kit (BELK for short), which provides all the necessary components required to start developing your application.  

The Bora Embedded Linux Kit contains everything you need to start developing your application, including all source trees (FPGA project, U-Boot and Linux kernel), which are provided as git repositories.

Contact Sarsen Technology to request a free information pack or to find out more!

Less Than 1 Week To Go... Have You Registered?

Author: Laura Biddiscombe

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This time next week it will all be coming to an end. But don't panic - you still have 5 days in which to register for your FREE Visitor badge for the Embedded Design Show 2014. 

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Sarsen Technology will be on Stand G32, where you can see the complete range of System-on-Module (SoM) and CPUs from DAVE Embedded Systems, which are based on the latest technologies, including the Freescale i.MX6 and Texas Instruments ‘Da Vinci’ DM814x and ‘Sitara’ AM387x processor families, and the brand new Xilinx ‘Zynq’ XC7Z010 / XC7Z020 SoC.

Laura, Manuele, Alberto and Nigel will be at the show so please stop by and say hello, and take a look at the exciting demo featuring the BORA module.

To be our guest at the exhibition, register for your free entry badge by clicking here, and if you'd like to attend any of the Conference sessions as our guest you can sign up for free by simply entering entering this discount code ENG14C.

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We look forward to seeing you there! 

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BittWare Currently Exhibiting at MILCOM 2014

Author: Laura Biddiscombe

Event: MILCOM 2014 - Find out more
Location: Baltimore Convention Center - Baltimore, MD
Date: October 06. 2014 - October 08. 2014

It's not too late to catch BittWare in Baltimore, MD, at the 33rd MILCOM event.
Attracting decision-makers from government, military, academia, and industry, MILCOM gathers military and government communications subject matter experts from around the globe to conduct in-depth discussions about the latest in technology advancements. This event is an ideal forum for industry to demonstrate the application of these technologies and to promote products and services that provide reliable solutions to today’s mission-critical challenges. Hundreds of technologies and solutions are being demonstrated right now.

BittWare are currently showcasing a host of their Altera FPGA-based hardware, including:

The Terabox - Integrated FPGA PCIe Platform

• 20 TeraFLOPS processing: 16x Altera Stratix V GX/GS FPGAs
• 1.28 Terabits/sec I/O
• 6.5 Terabits/sec memory bandwidth
• 4U or 5U Rackmount PCIe system (server, industrial, or expansion)

and the Channelizer – Integrated FPGA 6U VPX Platform

• 19” 2U rackmount enclosure
• 1-slot backplane
• BittWare Stratix V FPGA-based 6U VPX board
• 4-channel, up to 5 GSPS, 8-bit ADC
• 2-channel, 5.6 GSPS, 14-bit DAC
• 6U VPX rear transition module for access to VPX I/O

Join BittWare on Booth #419 at MILCOM until October 8 in Baltimore...

XMC/PMC and Rugged COM Express modules for high-temperature environments introduced by X-ES

Author - Laura Biddiscombe

We have a little treat for you - the brand new XPedite8101 Express Mezzanine Card and PCI Mezzanine Card (XMC/PMC) and XPedite8150 Rugged COM Express modules from Extreme Engineering Solutions (X-ES) have been featured in an article written by the editor of Military & Aerospace Electronics, John Keller.

Based on the Intel Atom E3800 processor family (formerly Bay Trail-I) these embedded computing modules are designed and tested for maximum reliability in the most demanding environments and applications that require long life cycles.

Read the full article

X-ES supports the Atom E3800 processor in industry-standard XMC/PMC and Rugged COM Express modules, enabling system integrators to develop a single x86-based application on modular hardware solutions that can be tailored for the performance and environmental constraints of each platform.

The XPedite8150 Rugged COM Express Module from Extreme Engineering Solutions

For more information or to request a quote please contact Sarsen Technology on +44 1672 511166, or drop us an email.